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ICs for Optical Disk Drive
AN8737SB
3-channel driver IC for optical disk drive
I Overview
The AN8737SB is a BTL type 3-channel driver IC, adopting a current feedback system for 2 channels, which makes it optimum for an actuator and a motor driver of CD-ROM/DVD-ROM. It can also constitute an optimum system in combination with the AN8488SB, a spindle plus loading driver IC. A surface mount-type package of good heat radiation characteristic is used.
18.400.20 (5.15) (4.80) 28 22 21 15 (1.315)
Unit: mm
10.930.30
8.300.20
0.30 -0.05
+0.10
0 to 10 1 7 8 14
I Features
* Little phase delay due to a current feedback system (2 channels for actuator) * The remaining channel is available for either traverse or loading motor drive. * Wide output dynamic range (4 V/IO = 800 mA) * Standby function built in (all channels can be muted.) * Thermal shut-down circuit built in * With thermal flag pin
(1.20) 0.80
+0.10
(6.40)
0.35 -0.05
Seating plane
HSOP042-P-0400 Note) The package of this product will be changed to lead-free type (HSOP042-P-0400D). See the new package dimensions section later of this datasheet.
I Applications
* CD/CD-ROM player * DVD/DVD-ROM drive
0.100.10
2.700.20
0.650.20
Publication date: November 2001
SDD00012BEB
1
AN8737SB
I Block Diagram
PVCC1 20 TFLG 16 VO3- PVCC2 1 2 VCC 17 Reset 18 VREF reset PC2 PGND2 SGND Fin 21 VO2- VO3+ IN3P 25 19 VO1- VO1+ VO2+ SVCC VCC det. 7
VS1
VS2 28
12
1 2 VCC PGND1 13
15
14
8
9
5
Temp. det.
VREF
26
N.C.
10
27
11
24 SB
VRB1
IN1 OUT1 OUT2 IN2
VFB2
I Pin Descriptions
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Description Ch. 2 first stage feedback pin Ch. 2 first stage input pin Ch. 1 first stage input pin Ch. 1 first stage feedback pin Ch. 1 current feedback input pin Ch. 1 current feedback output pin Control side power supply pin Ch. 1 & ch. 2 power side power supply pin Ch. 1 reverse direction output pin N.C. Ch. 1 & Ch. 2 mute pin Ch. 2 forward direction output pin Ch. 1 & ch. 2 power side grounding pin Ch. 2 reverse direction output pin Ch. 2 forward direction output pin Pin No. 16 17 18 19 20 21 22 23 24 25 26 27 28 Fin Description Ch. 3 reverse direction output pin Ch. 3 power side grounding pin Ch. 3 mute pin Ch. 3 forward direction output pin TDS flag pin Ch. 3 power side power supply pin N.C. Ch. 3 reverse rotation input pin Standby input pin Ch. 3 forward rotation input pin Reference voltage input pin Ch. 2 current feedback output pin Ch. 2 current feedback input pin Control side grounding pin
2
SDD00012BEB
IN3N
PC1
23
6
3 4 1 2
AN8737SB
I Absolute Maximum Ratings
Parameter Supply voltage Supply voltage range Supply current
*2
Symbol VCC SVCC , PVCC1 , PVCC2 ISVCC IPVCC1 IPVCC2
Rating 14.0 - 0.3 to +14.0 500 2.0 800 542 -30 to +85 -55 to +150
Unit V V mA A mA mW C C
Power dissipation
*3 *1
PD Topr Tstg
*1
Operating ambient temperature Storage temperature
Note) *1: Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25C. *2: IPVCC1 be 1 A or less for channel 1 and channel 2, respectively. *3: Use within the range of PD = 542 mW or less at Ta = 85C, following the allowable power dissipation characteristic curve of "I Application Notes".
I Recommended Operating Range
Parameter Supply voltage Symbol SVCC PVCC1 , PVCC2 Range 4.5 to 13.5 3.5 to 13.5 Unit V
I Electrical Characteristics at SVCC = 12 V, PVCC1 = 5 V, PVCC2 = 5 V, RL = 8 , VREF = 1.65 V, VSB = VPC1 = VPC2 = 3.3 V, VIN1 = VIN2 = VIN3 = 1.65 V, Ta = 25C
Parameter Current consumption 1 (no signal) Current consumption 2 (no signal) Current consumption 1 (standby) Current consumption 2 (standby) Driver 1, Driver 2 Output offset voltage Gain (+) Relative gain (+/-) Maximum output amplitude (+) Maximum output amplitude (-) Symbol ISVO IPVO ISVSB IPVSB Conditions VIN1 = VIN2 = VREF , VIN3P = 2.5 V VSB = VPC1 = VPC2 = 3.3 V VIN1 = VIN2 = VREF , VIN3P = 2.5 V VSB = VPC1 = VPC2 = 3.3 V VIN1 = VIN2 = VREF , VIN3P = 2.5 V VSB = VPC1 = VPC2 = 0 V VIN1 = VIN2 = VREF , VIN3P = 2.5 V VSB = VPC1 = VPC2 = 0 V VIN = VREF VIN = VREF 50 mV VIN = 3.3 V, RL1 , RL2 = 4 RS1 , RS2 = 0.5 VIN = 0 V, RL1 , RL2 = 4 RS1 , RS2 = 0.5 Min Typ 25 25 0.6 0.2 Max 45 45 1.5 1.0 Unit mA mA mA mA
RL1 , RL2 = 4 , RS1 , RS2 = 0.5 , RIN1 , RIN2 = 10 k, RF1 , RF2 = 4.3 k VOF1 G1+ G1 VL1+ VL1- -100 9 -1.5 3.65 0 11 4.0 -4.0 100 13 +1.5 -3.65 mV dB dB V V
SDD00012BEB
3
AN8737SB
I Electrical Characteristics at SVCC = 12 V, PVCC1 = 5 V, PVCC2 = 5 V, RL = 8 , VREF = 1.65 V, VSB = VPC1 = VPC2 = 3.3 V, VIN1 = VIN2 = VIN3 = 1.65 V, Ta = 25C (continued)
Parameter Driver 3 RL = 8 VOF3 G3+ G3 V3+ V3- IIN3 VSBH VSBL ISB VIN3N = 5 V, RA1 = 27 k, RA2 = 6.8 k VIN3N = 0 V, RA1 = 27 k, RA2 = 6.8 k VIN3N = 0 V SVCC = 12 V SVCC = 12 V VSB = 5 V SVCC = 12 V SVCC = 12 V SVCC = 12 V SVCC = 12 V VPC1 = 5 V VPC2 = 5 V VIN3P = VIN3N = 2.5 V VIN3P = 2.5 V, VIN3P = 2.5 V50 mV No external resistor -150 19 -1.5 3.05 -3.75 2.6 0 20.5 3.4 -3.4 50 70 70 150 22 +1.5 3.75 -3.05 1 0.7 120 0.7 0.7 120 120 mV dB dB V V A V V A Symbol Conditions Min Typ Max Unit
Output offset voltage Gain (+) Relative gain (+/-) Output voltage (+) Output voltage (-) Input pin bias current Standby operation
High: Active, low or Hi-Z: Standby
High-level SB threshold voltage Low-level SB threshold voltage SB input current Power cut operation
High: Active, low or Hiz: Power cut VPC1H VPC1L VPC2H VPC2L IPC1 IPC2 VRST VR 2.6 2.6 1.20 V V V V A A V V
High-level PC1 threshold voltage Low-level PC1 threshold voltage High-level PC2 threshold voltage Low-level PC2 threshold voltage PC1 input current PC2 input current Reset current Reset operation release supply voltage VREF detection voltage * Design reference data
4.5
Note) The characteristics listed below are theoretical values based on the IC design and are not guaranteed.
Parameter Thermal protection circuit Operating temperature equilibrium value Operating temperature hysteresis width Temperature flag balancing value Temperature flag hysteresis width
Symbol
Conditions
Min
Typ
Max
Unit C C C C
TTHD TTHD TFLG TFLG
160 40 150 20
4
SDD00012BEB
AN8737SB
I Electrical Characteristics at SVCC = 12 V, PVCC1 = 5 V, PVCC2 = 5 V, RL = 8 , VREF = 1.65 V, VSB = VPC1 = VPC2 = 3.3 V, VIN1 = VIN2 = VIN3 = 1.65 V, Ta = 25C (continued)
* Design reference data (continued)
Note) The characteristics listed below are theoretical values based on the IC design and are not guaranteed.
Parameter
Symbol TTF VFLH VHD SVCC = 12 V
Conditions
Min
Typ
Max
Unit C V V
Thermal protection circuit (continued) Operating temperature difference bet. thermal protection/temperature flag Temperature flag output high value Supply voltage detection hysteresis width 10 5 0.2
I Usage Notes
1. Use SVCC at the maximum potential. Otherwise it will cause operation error. 2. Do not use PVCC1 and PVCC2 at 2 V or less, or at the high impedance. 3. Driver 1, driver 2 gain setting (Use a resistor of sufficient power dissipation for RS .)
RE
CE
4 or 1
RIN VIN RFB
Input pin
3 or 2 500
200
Forward rotation pin x 5 12 or 15 x 5 9 or 14 Pwr. amp.
RL 4 RS 0.5
VREF 6 or 27 500
VREF 5 or 28 Reverse rotation pin VREF
4. On the mode of mute: SB = PC1 = high PC2 = high Ch. 1, Ch. 2 Ch. 3 Active Active PC2 = low or Hi-Z Active Mute SB = PC1 = low or Hi-Z All mute, power save
Never fail to input the same signal into SB pin (pin 24) and PC1 pin (pin 11).
SDD00012BEB
5
AN8737SB
I Usage Notes (continued)
5. On the output maximum amplitude (Reference data: typical value)
5.0
Output maximum amplitude (V)
4.5
4.0
3.5
3.0 0.4
0.6
0.8
1.0
1.1
Load current (A)
Use load current at 1 A or less. 6 Appropriate care should be taken on the characteristics. When changing an external circuit constant on actual use, secure an appropriate margin in consideration of characteristic fluctuation of external parts and our ICs including transient characteristics as well as static ones. Avoid the short-circuits between output pin or current detection pin and VCC (line-to-supply fault), output pin or current detection pin and GND (line-to-ground fault), and output pins or output pin and current detection pin (load short-ciruit). An appropriate prior study should be done for use of dip soldering. Care should be taken on use of the following pin because of its low static breakdown voltage (C = 200 pF, R = 0 ). Pin 18: Breakdown at 200 V
7
8 9
6
SDD00012BEB
AN8737SB
I Application Notes
* PD Ta curves of HSOP042-P-0400 PD T a
2.500 2.240 2.000
Power dissipation PD (W)
Mounted on standard board (glass epoxy: 75 mm x 75 mm x t1.6 mm) Rth(j-a) = 55.8C/W 1.500
1.042 1.000 Independent IC without a heat sink Rth(j-a) = 119.9C/W 0.500
0.000 0
25
50
75
100
125
150
Ambient temperature Ta (C)
SDD00012BEB
7
AN8737SB
I Application Circuit Example
Snubber Snubber 12 V RS1 0.5 RL1 4.0 RL2 4.0 RS2 0.5 RL2 8.0
5V
High: High temp.
5V
PVCC1
12 VO1+
15 VO2+
28 VS2
1 2 VCC PGND1 13
VCC det.
Temp. det.
21 PVCC2 1 2 VCC 17 PGND2 18
VO1-
TFLG
16 VO3-
Reset
VREF 26
1.65 V
VREF reset
19 VO3+
14 VO2-
SVCC 7
VS1
20
8
9
5
PC2
N.C.
10
VFB2 27
PC1 11
VRB1
IN1
OUT1
OUT2
IN2
SB 24
6.8 k 27 k
560 pF 4.3 k 4.7 k RIN2 = 10 k
560 pF 4.7 k 4.3 k
IN3N
RIN2 = 10 k
High: Active Low : All mute power save
I New Package Dimensions (Unit: mm)
* HSOP042-P-0400D (Lead-free package)
18.400.20 (5.15) (4.80) 28 22 21 15 (1.315)
8.300.20 10.930.30
0.30-0.05
+0.10
0 to 10 0.500.20 (6.40) 0.80
(1.20)
0.35+0.10 -0.05
Seating plane
0.100.10
2.700.20
1
7
8
14
Seating plane
8
SDD00012BEB
IN3P
SGND
Fin
23
25
4
1
6
3
2
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company.
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.
2001 MAR

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